Dicing Surfactant

Keteca Diamaflow

For a free trial - Call us on +44 (0)2380 760 909 or e-mail info@U4Global.com

The world’s market leader in the category, Diamaflow dicing solutions are formulated to prevent corrosion and to solve the problem of dust adhering on semiconductor wafers during the die separation process. Formulated using several special precision cleaning, surface-active, non-ionic surfactants – each selected for a specific purpose – these dicing solutions are introduced to the dicing water via Diamaflow Automatic Dispensing Systems.

Effectiveness of Keteca Diamaflow

On wafer saw dust

Without Diamaflow	With Diamaflow

On corrosion

How does Diamaflow work?

Diamaflow is mixed with D.I. water in our dispensing systems and the mixture is fed into saw machines through the regular D.I. water lines.
 
Diamaflow dicing solutions enhances the wetting and lubricity characteristics of D.I. water. Diamaflow reduces the water surface tension by more than 50%. This reduces the amount of dry spots on the wafer during sawing and prevents direct contact between wafer dust and the wafer.

When Diamaflow molecules adhere to the dust particle, the contact angle between the particle and the surface increases. The dust particle is eventually removed from the surface as more Diamaflow molecules are attached to it. While the lipohilic molecules attach themselves to the particle, the hydrophilic (water loving) tails suspended the particle in the water solution. This allows the particle to be washed away with ease.

This significantly reduces wafer and bonding pad surface contamination resulting from dicing.

Other advantages

Enhance cut quality and extend blade life

The Diamaflow/D.I. water mixture has a reduced water tension which allows it to seep and flow easily into the kerf. Newly generated dust particles are quickly wet and are easily removed from the cutting area. This leads to a reduction in friction generated during dicing. With less loading on the blade, the cut quality is enhanced with reduced chipping and the lifetime of the dicing blade can be extended.

Increase cutting speed

With increased lubricity and less loading on the blade, it allows the feed rate to be increased. This translates to an increase in wafer saw throughput

For a free trial - Call us on +44 (0)2380 760 909 or e-mail info@U4Global.com